Samsung Postpones Implementation of Advanced Chipmaking Equipment to 1nm Node

Samsung Foundry has officially decided to delay the full-scale commercial integration of its most advanced chipmaking technology, pushing the adoption of next-generation manufacturing tools further into the future. While industry watchers previously anticipated these state-of-the-art machines to arrive alongside earlier fabrication cycles, current ecosystem realities have prompted a strategic shift by the semiconductor giant.

Ecosystem Delays Push High-NA EUV Rollout for Samsung Foundry

Samsung remains a dominant force in the global semiconductor sector and proudly holds the distinction of being the first to launch chips made using a 3nm-class node. Initial industry roadmaps suggested that the manufacturer would quickly upgrade its infrastructure to incorporate the world's most cutting-edge lithography systems for the upcoming 2nm production lines.

However, Park Chang-min, Master of the Foundry Process Development Team at Samsung's Semiconductor R&D Center, shared crucial updates during the Next Generation Lithography + Patterning Conference (NGL 2026). The corporation will officially postpone the large-scale commercial introduction of High-NA EUV (Extreme Ultraviolet) machinery, reserving it instead for the 1nm process node (A10), with initial commercial shipments projected for 2030.

Although initial plans targeted High-NA EUV implementation for both 2nm and 1.4nm nodes, internal evaluations revealed that the supporting vendor ecosystem is not yet mature enough. Essential requirements—including specialized masks, protective pellicles, and next-generation chemical materials—are still under joint development and lack the necessary mass-production readiness.

Financial Hurdles and Alternative Manufacturing Strategies

Beyond technical roadblocks, financial considerations play a massive role in the delay. Each High-NA EUV system demands a staggering investment ranging from $350 million to $400 million, presenting a heavy capital expenditure even for industry leaders like Samsung.

To maintain competitive momentum without premature hardware adoption, Samsung Foundry will rely on established 0.33 NA EUV equipment combined with multi-patterning methodologies for the 2nm and 1.4nm generations. High-NA EUV systems expand the numerical aperture from 0.33 to 0.55 to collect more light and achieve sharper resolution, paving the way for single-patterning microscopic circuits.

Meanwhile, industry rivals are taking varying paths. Intel has already adopted High-NA EUV equipment for targeted layers within its 2nm-class Intel 18A nodes utilized in processors like Panther Lake and Core Ultra Series 3. Conversely, TSMC has acquired similar tools primarily for research and development purposes, aligning its commercial rollout schedule closely with Samsung around 2029 or 2030.

When will Samsung officially start producing chips with High-NA EUV machines?

Samsung has scheduled the full-scale commercial utilization of High-NA EUV lithography equipment for its advanced 1nm process node, with products expected to reach the market around 2030.

Why did Samsung decide to delay the adoption of High-NA EUV technology?

The postponement stems from an immature supporting ecosystem. Key components such as specialized masks, pellicles, and advanced materials are still lacking, alongside the immense financial cost of individual machines reaching up to $400 million.

What manufacturing approach will Samsung use for its 2nm and 1.4nm nodes instead?

For the upcoming 2nm and 1.4nm process nodes, Samsung Foundry will employ standard 0.33 NA EUV systems integrated alongside multi-patterning techniques to achieve the desired precision.

How does Samsung's timeline compare with other leading semiconductor foundries?

While Intel has already begun incorporating High-NA EUV tools for specific semiconductor layers, TSMC has similarly positioned its machines for R&D use with commercial production deployments anticipated between 2029 and 2030.

🔎 As the semiconductor landscape undergoes rapid transformation, Samsung's calculated delay highlights the delicate balance between pushing technological boundaries and ensuring robust supply chain readiness. By refining its multi-patterning approach for upcoming nodes while incubating advanced lithography ecosystems for the 1nm milestone, the company aims to secure long-term stability and performance excellence in future generations of processor manufacturing.